International Workshop on Heterogeneous Mobile Edge Computing
(HMEC 2019)
in conjunction with IEEE VTC 2019 Spring
(28 April – 1 May 2019 in Kuala Lumpur, Malaysia)
(HMEC 2019)
in conjunction with IEEE VTC 2019 Spring
(28 April – 1 May 2019 in Kuala Lumpur, Malaysia)
hmec19_cfp.pdf | |
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Scope and Topics
The recent development of wireless networking and mobile cloud computing initiates an emerging cyber system called mobile edge computing, or multi-access mobile edge computing (MEC). MEC proposes moving computing and data processing capability away from distant cloud datacenters to edge servers that are located closer to the mobile devices to offer users the lowest possible latency, the highest possible bandwidth, and direct access to real-time network services.
Although MEC is expected to largely improve the QoS and QoE for mobile applications, it is challenging to realize and utilize the MEC systems effectively and efficiently due to its inherent heterogeneities. First, since a typical MEC datacenter is supposed to be composed of heterogenous resources such as CPU clusters, GPU clusters, FPGAs, programable network routers, etc., the heterogeneity makes the integration with traditional orchestration frameworks a fundamental challenge. In addition, due to the differences in scales, architectures, and Internet access technologies, it is challenging to realize the coordination of multiple MEC datacenters for conducting complicated tasks. Finally, the applications using MEC are also heterogenous. Different applications have different objectives and metrics, and correspondingly different flavors to specific MEC servers. Therefore, not only application-specific optimization, but also joint optimization of multiple applications and the MEC orchestration has to be considered. Addressing these issues efficiently will have significant importance to the future mobile computing and communications technologies. The objective of this workshop is to identify and address the challenges and opportunities of developing and utilizing HMEC. Each submission must be up to 5 pages in length and conforms to the double-column template provided by IEEE. Potential topics include but are not limited to the following:
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Important Dates:
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Submission Guidelines:
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